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Fluxless Soldering Method Disclosure Number: IPCOM000062268D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09

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Shi, L [+details]


The oxide surface layer formed on solder to be reflowed can be broken by thermal fatigue to permit molten solder beneath the surface to flow through the openings by compression and wet the joined material.