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The oxide surface layer formed on solder to be reflowed can be broken by thermal fatigue to permit molten solder beneath the surface to flow through the openings by compression and wet the joined material.
English (United States)
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Fluxless Soldering Method
The oxide surface layer formed on solder to be reflowed can be broken by
thermal fatigue to permit molten solder beneath the surface to flow through the
openings by compression and wet the joined material.
During solder reflow for joining a pair of members, the solder ball on one of
the members is subjected alternately to successive cycles of melting and
solidifying to crack the oxide layer by thermal fatigue. Thereafter, the second
member is compressed into contact with the solder ball to force underlying
molten solder through the cracks and join the second member. Compression is
illustrated in the FIGURE where component lead 1 is urged by spring 2 into
contact with solder ball 3 on pad 4.