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Fluxless Soldering Method

IP.com Disclosure Number: IPCOM000062268D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Shi, L [+details]

Abstract

The oxide surface layer formed on solder to be reflowed can be broken by thermal fatigue to permit molten solder beneath the surface to flow through the openings by compression and wet the joined material.