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Thermal Conduction Influence Methodology Disclosure Number: IPCOM000062338D
Original Publication Date: 1986-Nov-01
Included in the Prior Art Database: 2005-Mar-09

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Grawoig, BC [+details]


A methodology is described to determine the junction temperature of electronic component packages by considering the thermal influence factors of other components in close proximity to the module of interest. This technique can also be used to quantify the distance modules must be separated when the effects of adjacent modules cause one or more modules to exceed their allowable temperature specification limits. The methodology can be incorporated into the design process to establish adequate spacing requirements prior to building expensive hardware. The junction temperature of a module is defined by the following equation: (Image Omitted) For a given package in a prescribed system, natural convection environment, the only factor which influences the junction temperature (which can be changed) is T(s), the surface temperature.