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Automated Pin Attachment by Welding

IP.com Disclosure Number: IPCOM000062368D
Original Publication Date: 1986-Nov-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Gesell, J Phelps, DW Ward, WC [+details]

Abstract

Input/output (I/O) pins are welded to I/O pads on ceramic semiconductor chip carriers by an automated process. Pins are preformed, e.g., by punching a metal tape. During welding to chip carriers, the pins remain attached to selvage strips which are perforated to allow accurate, automatic feeding in alignment with chip carriers. Roller electrodes are in contact with pin material over I/O pads on chip carriers and pulses of welding current are programmed to result in multiple, overlapping welds of pin material to pad material. An example is given wherein pins are welded to one edge of each of two sets of chip carriers in a continuous process.