Browse Prior Art Database

Multiple Chip Heat Sink Package

IP.com Disclosure Number: IPCOM000062382D
Original Publication Date: 1986-Nov-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Lumbra, DL Marks, R Phelps, DW Ward, WC [+details]

Abstract

A multiple chip package is comprised of a conductive material, e.g., beryllium-copper preformed "muffin tin" to which the backs of semiconductor chips, already wire bonded to a lead frame assembly and burn-in tested, are thermally contacted via conductive grease. The lead frame assembly is bonded to chip edges and to flat portions of the "muffin tin" by double-sided tape. A layer of flex circuit is tape bonded and electrically connected to the lead frame wiring. The flex circuit is used to form the connections to the next level of packaging. A second "muffin tin", chip, lead frame, and flex circuit assembly may be tape bonded to a first such assembly, resulting in a completely enclosed, high volume density, multi-chip package with good heat dissipation characteristics.