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Automatic Semiconductor Chip Electrical Test Probe Alignment System

IP.com Disclosure Number: IPCOM000062402D
Original Publication Date: 1986-Nov-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Allard, HC Cook, DJ Thomas, DR [+details]

Abstract

A method is provided for automatically detecting and correcting on- the-fly semiconductor chip electrical test probe pin to pad alignment and making probe position corrections based on feedback information received by a controller from certain alignment aid probes. Fig. 1 is a diagram of an electrical test probe alignment system 10 which features automatic test probe alignment aid feedback techniques for keeping test probe pins and chip pads in registration during electrical tests. The system includes a controller 11, typically a desk top computer, interfacing electrical bus 12, means for generating voltage and measurement currents 13, which are bussed to probe station 14 through an electrical bus 15 and connected to a probe pin system shown in Fig. 2.