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Adjustable Alloy Deposition Using Hollow Cathode Electrodes

IP.com Disclosure Number: IPCOM000062464D
Original Publication Date: 1986-Nov-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Bumble, B Rossnagel, SM [+details]

Abstract

A method for adjusting the composition of alloy layers utilizing cathode plasmas is described herein. The method can be most easily understood with reference to Fig. 1. In this figure, a simple RF sputtering system is shown with the primary alterations to the powered electrode 3. The system consists of a grounded vacuum chamber 4 with some means of vacuum pump pumping 5 and the introduction of a working gas 6 through a leak valve 7. The electrode 3 is powered by an RF generator 8, and the power is conducted to the electrode 3 through a standard matching network 9. A plasma will be formed in the chamber 4 if there is suitable RF power supplied to the electrode and the gas pressure is in a suitable range (millitorr).