Surface-Soldered Component Removal and Replacement Machine Utilizing Infrared Heating and Shields
Original Publication Date: 1986-Nov-01
Included in the Prior Art Database: 2005-Mar-09
A machine and process are described which remove and replace individual surface-soldered components on a circuit board using infrared heat. The machine uses a ring-shaped infrared heater to reflow the solder joints of an individual surface-soldered component on a circuit board. This heating process may be used to either remove a component or put on a new component. A vacuum chuck is used to pick up a component during component removal and to place a component during component reattachment. Metallic shields are used to protect nearby components and nearby areas of the circuit board. An X-Y table is used to provide accurate alignment of the component leads to the pads on the circuit board. An operator puts new components into the vacuum chuck or removes old components from the vacuum chuck.