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Liquid-Cooled Circuit Package With Jet Impinging on Heat Sink Held Against Semiconductor Chip That Is Sealed From the Jet

IP.com Disclosure Number: IPCOM000062538D
Original Publication Date: 1986-Dec-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Antonetti, VM Eid, JC Zumbrunnen, ML [+details]

Abstract

A circuit package has a chip carrier, an array of chips mounted on the carrier, a metal heat sink for each chip, and a flexible seal that carries the heat sinks and forms part of an enclosure for the chips, as is broadly conventional. The package also includes a plate that is mounted above the heat sinks and the seal and cooperates with the seal to form a second enclosure. The plate has an array of holes that each receive a shaft that extends upwardly from each heat sink, and each hole carries a spring that urges a heat sink into thermal contact with its chip. Thus the shaft is mechanically a counterpart of a piston in a known circuit package called a thermal conduction module (TCM).