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Domed Solder Joints for Surface Solder Leads

IP.com Disclosure Number: IPCOM000062559D
Original Publication Date: 1986-Dec-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Napp, D [+details]

Abstract

The present cross-sectional geometry of surface solder leads results in the quantity of solder under the lead after reflow to be dependent upon many factors, e.g., solder screened/stenciled onto the pad, weight of the component, force exerted on the component during placement, fixture of component prior to reflow, etc. As a result of component and process variables, the quantity of solder is variable which produces a solder joint of variable strength. The quantity of solder under the lead can be increased and controlled by the design of the lead shown in Figs. 1 and 2. By reforming the lead to obtain a dome of solder under the lead a constant quantity of solder can be assured under the lead. This quantity of solder will assure a reliable solder joint for stress in the Z direction.