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Technique for Obtaining an Environmentally Secure Adhesive Seal

IP.com Disclosure Number: IPCOM000062618D
Original Publication Date: 1986-Dec-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Arnold, AJ Booth, RB [+details]

Abstract

A method has been developed for sealing module hats to substrates used for semiconductor packaging so as to provide environmental integrity. The procedure uses an adhesive to hold the hat and substrate together and a soft metal shield to provide a barrier to penetration of gases and moisture. Adhesives used for sealing microelectronic modules have limited effectiveness as a barrier to penetration by gas and moisture. There are both practical and physical limitations on the extent to which any seal may be enhanced by changing the configuration of the adhesive alone. As described herein, a continuous metal shield is used in conjunction with the adhesive. The soft metal will be deformed upon mating of the major constituents of the assembly.