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Immersion Wave Soldering Flux

IP.com Disclosure Number: IPCOM000062661D
Original Publication Date: 1986-Dec-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Rott, W Stehling, J [+details]

Abstract

It is proposed that in lieu of a 5% b.w. Na2EDTA glycerin flux a 2 to 6% b.w. Na4EDTA glycerin flux be used. In advanced packaging, the circuit boards, fitted with contact springs, are soldered in an immersion wave soldering process. For that purpose, the boards are immersed in an about 160ŒC hot glycerin flux, activated with EDTA, which ensures that the circuit boards are uniformly heated to process temperature and that board and contact spring surfaces are free of oxides and other impurities. In lieu of the previously used Na2EDTA glycerin flux, a 2 to 6 % b.w. Na4EDTA glycerin flux bath is used.