Substrate With Top Surface Metallurgy Adapted for Mixed Technology Device Bonding and Processing
Original Publication Date: 1986-Dec-01
Included in the Prior Art Database: 2005-Mar-09
This technique provides electrical connection terminals on a substrate for the attachment of both solder joined flip-chip semiconductor devices and back-bonded exposed-face wire-bond devices on the same substrate. The wire bonds are monometallic aluminum and isolated from the solder metals, allowing this combination to coexist even under the extreme temperatures (375ŒC) required to chip back-bond or solder attach or repair flip-chip devices, as can be required on multi-chip modules and without exposure of solder pots to aluminum contamination during tinning.