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Double-Dip Tinning Fixture

IP.com Disclosure Number: IPCOM000062676D
Original Publication Date: 1986-Dec-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Emerick, AJ Hill, KE Owen, CJ [+details]

Abstract

A fixture that holds substrates for immersion into a solder wave has a protruding wire to cut the solder surface such that the surface oxide does not interfere with the soldering. The fixture is used in the following manner. The fixture consists of a base 1 which is attached to a handle 2. Two substrate-holding brackets 3 are attached to the base 1 by means of tabs 4 which are attached to recesses 5 of base 1. A wire 6 is passed through holes 7 of bracket posts 8. A substrate 9 is mounted to the fixture when snapped into place between the posts 8 of the bracket. The substrate 9 rests on the wire 6. A thin leading edge of fixture serves to break the oxide surface of the solder when the fixture is immersed in solder. The thin leading edge is the wire 6.