Browse Prior Art Database

Solder Ball Alignment Device

IP.com Disclosure Number: IPCOM000062716D
Original Publication Date: 1986-Nov-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Curtis, DR Steinbach, SC [+details]

Abstract

The figure illustrates a placement process of small solder balls 10 to a multi-layer ceramic surface solder device 11. The balls are very small (25 mils or less), and must be located and held to a template 13 having drilled holes smaller than the solder balls, and spaced apart to match the ceramic device electrical contacts.