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Solder Ball Alignment Device Disclosure Number: IPCOM000062716D
Original Publication Date: 1986-Nov-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue


Related People

Curtis, DR Steinbach, SC [+details]


The figure illustrates a placement process of small solder balls 10 to a multi-layer ceramic surface solder device 11. The balls are very small (25 mils or less), and must be located and held to a template 13 having drilled holes smaller than the solder balls, and spaced apart to match the ceramic device electrical contacts.