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Sputtering of Metal On Polymers

IP.com Disclosure Number: IPCOM000062727D
Original Publication Date: 1986-Nov-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Morrison, GD Nair, KK Varcoe, JA [+details]

Abstract

In sputtering Cu on polyimide at high rates, polyimide has been seen to develop microcracks and to have poor adhesion. The microcracks are believed to be due to excessive heating at the surface of the polyimide and/or ionic and electronic bombardment due to the plasma. The loss of adhesion of the metal to the polyimide is believed to be due to changes in the surface chemistry of the polyimide caused by the ionic bombardment.