Browse Prior Art Database

Method for Very Flat Wafer Polishing

IP.com Disclosure Number: IPCOM000062736D
Original Publication Date: 1986-Nov-01
Included in the Prior Art Database: 2005-Mar-09

Publishing Venue

IBM

Related People

Authors:
Luhrs, GH Mendel, E [+details]

Abstract

A process has been developed for manufacturing thin semiconductor wafers which are mechanically flat. The procedure results in flat polished Si wafers with a flatness maximum of 3 microns while eliminating residual saw marks.