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A method is described to cause electronic components to self-align on the circuit card during a soldering operation.
English (United States)
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System for Automatic Registration of Components During Soldering
A method is described to cause electronic components to self-align on the
circuit card during a soldering operation.
It is widely recognized in the electronics industry that during soldering, small
components self-align if they are not constrained. Larger, heavier components,
however, are prevented from self-aligning (moving) by gravity induced friction.
This method insures self-alignment of all components by introducing controlled
vibration or vertical movement to the assembly of the components and circuit p
while the solder is molten. This small vertical motion allows the natural surface
tension of the molten solder to pull the leads of the component into perfect
alignment with the circuit pads to which they are being joined. The controlled
vertical movement is induced both during initial soldering in an in-line vapor
phase system and during repair operations after the solder has melted. The
vertical motion can be created by a rotating eccentric shaft or a solenoid which
contacts the underside of the belt or surface on which the panel or card is