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Solder Mask Lamination Disclosure Number: IPCOM000062774D
Original Publication Date: 1986-Dec-01
Included in the Prior Art Database: 2005-Mar-09

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Lazzarini, DJ Pernes, RJ Pessarchick, JJ [+details]


The vacuum lamination of photosensitive dry film solder masks to large, thick, printed circuit panels requires special processing techniques. One problem that occurs periodically during lamination is entrapped air bubbles and wrinkles over functional co circuitry, which results in reliability exposures. This occurrence is particularly severe with warped composites (panels).