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Module Heatsink-To-Ceramic Cap Joint Soldering

IP.com Disclosure Number: IPCOM000062830D
Original Publication Date: 1985-Jan-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
DiGiacomo, G DiPaolo, N [+details]

Abstract

This process uses copper wire mesh, coated with lead/tin solder, to join the heatsink and ceramic cap in the manufacturing of electronics components. The copper wire mesh is sandwiched between two sheets of solder. The copper mesh/solder composite is then solder reflowed between the heatsink and ceramic cap while under the required compression. The copper wire mesh accomplishes three things: 1. Restricts the degree of solder expansion to that of copper. 2. Prevents the cracking of a solder joint. 3. Acts as a buffer between the thermally mismatched heatsink and ceramic cap.