Improvement of Thermal Stability of Josephson Junction Electrode Material
Original Publication Date: 1985-Jan-01
Included in the Prior Art Database: 2005-Feb-18
Thermal stability of lead alloy films at 4.2Œ Kelvin is improved using a palladium (Pd) seeding followed by a lead (Pb) indium (In) coevaporation technique. In the technique performed at room temperature, a layer of Pd of the order of 4 nanometers thick is deposited on the substrate. This is followed by a simultaneous evaporation of Pb and In to the desired thickness.