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Improvement of Thermal Stability of Josephson Junction Electrode Material Disclosure Number: IPCOM000062838D
Original Publication Date: 1985-Jan-01
Included in the Prior Art Database: 2005-Feb-18

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Murakami, M Tu, KN [+details]


Thermal stability of lead alloy films at 4.2ΠKelvin is improved using a palladium (Pd) seeding followed by a lead (Pb) indium (In) coevaporation technique. In the technique performed at room temperature, a layer of Pd of the order of 4 nanometers thick is deposited on the substrate. This is followed by a simultaneous evaporation of Pb and In to the desired thickness.