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Dual Wafer Backside or Edge Contact Handling Tool for Robots Disclosure Number: IPCOM000062869D
Original Publication Date: 1985-Jan-01
Included in the Prior Art Database: 2005-Feb-18

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Related People

Pinckney, WJ Riach, WR [+details]


This article describes a tool which eliminates scratches and/or contamination presently occurring on semiconductor wafer surfaces during load/unload handling operations, and which also offers a means for automating such operations with robots. The tool disclosed contacts the wafer only on its backside or edge during handling. It is known to transport wafers during such processes as epitaxial deposition in the following manner: The wafers are individually removed from a transport carrier and transported to a process susceptor (a vertically aligned plate). The wafers must then be placed in shallow susceptor pockets (inclined from the vertical). This operation involves careful positioning of the wafer into the shallow pocket and subsequent release to avoid physical damage to the wafer or to the susceptor.