Browse Prior Art Database

Improved Chip Cooling

IP.com Disclosure Number: IPCOM000062891D
Original Publication Date: 1985-Jan-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Waldman, DP [+details]

Abstract

This technique uses a heat sink, with a metallurgical bond to the IC chip, providing increased cooling of the chip. The heat sink is fabricated by electro discharge machining a block resulting in cooling fingers with typical dimensions of 3-mil diameter and 10-mil length. The heat sink (typical material - copper/Au plated or Au clad Cu or copper) is bonded to the chip by a AuSi eutectic metallurgical bond. An alternate bond could be accomplished by PdAu or CrCuAu type interface metallurgy on the chip and joining with solder. C4 mechanical support may be accomplished by machining one of the cooling pins to a longer length and resting it in an opening of a support plate.