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Improved Metal-To-Ceramic Adhesion for MLC Structures

IP.com Disclosure Number: IPCOM000062895D
Original Publication Date: 1985-Jan-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Herron, LW Master, RN Nufer, RW [+details]

Abstract

The technique presented here is for the purpose of improving adhesion of metal adhesion to MLCs (multilayer ceramics). This is accomplished by the use of dummy vias to increase the area of interface between the surface metal and the ceramic to improve adherence between them. The additional dummy vias do not affect the electrical properties of the ceramic.