POST Pb/Sn DEPOSITION MASK SEPARATION
Original Publication Date: 1985-Jan-01
Included in the Prior Art Database: 2005-Feb-18
This article describes an apparatus and method for separating post metallic deposited silicon wafers from the masks used to define the C-4 pads on a wafer, while the evaporated pads are molten. The silicon wafer 1 is attached to the moly-mask 2, which is supported by the inverted moly-mask ring 3. The wafer vacuum chuck 4 is attached to the wafer backside by vacuum and exerts mechanical force between wafer 1 and moly-mask 2, to effect separation of wafer 1 and moly-mask 2, when applied heat reflows the pads 5.