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Immersion Forced Cooling of High-Powered Chips

IP.com Disclosure Number: IPCOM000062913D
Original Publication Date: 1985-Jan-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Feurstein, D Oktay, S [+details]

Abstract

This technique uses forced convection liquid cooling of integrated circuit chips immersed in a fluorocarbon bath. Highest heat transfer coefficients are obtained in immersion cooling with liquids, when nucleate boiling occurs. The pumping action of the bubbles effects a constant washing of the heated surface by the entrained liquid. Heat transfer also results from bubble nucleation due to the phase change. On a smooth surface, spontaneous bubble nucleation often occurs at temperatures higher than the boiling point of the liquid. In the absence of boiling, heat transfer coefficients remain at their low, natural convection levels. With this method, this effect is minimized by superimposing forced convection liquid cooling of the chips, already immersed in a dielectric liquid cooling bath.