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Radial Cooling Finger-To-Module Interface Wax Mixture

IP.com Disclosure Number: IPCOM000062932D
Original Publication Date: 1985-Jan-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Chiarenzelli, RV DiGiacomo, G Horvath, JL [+details]

Abstract

This process provides an interface wax, for use between radial finger contacts and integrated circuit chips, that will prevent corrosive interface degradation, and will yield to low temperature cycling without exerting excessive mechanical forces on the chip. The wax mixture consists of 1:1 mixture of paraffin and polyphenyl ether, dissolved in 1,1,1-trichloroethane. The wax mixture is applied by immersion of the radial finger contact in the solution. The wax mixture will prevent interface corrosion between radial finger contacts and integrated circuit chips, while mechanically yielding to thermal cycling without exerting excessive forces on the chip backside.