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Clipped Decoupled Twin-Carrier Module for IC Memory Chips

IP.com Disclosure Number: IPCOM000062943D
Original Publication Date: 1985-Jan-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Hinrichsmeyer, K Stadler, EE Stahl, R [+details]

Abstract

A clipped decoupled twin-carrier module for IC memory chips is disclosed which allows a very flat assembly, as no pins are required for connecting the two chip carriers. Fig. 1 shows a horizontal version of the twin-carrier module. Two chip carriers 1 are mounted back-to-back. A supply voltage decoupling capacitor 2 is clamped between the two chip carriers 1. The assembly is held together by clips 3 that are soldered to pads on carriers 1. Joint signals and the power input for both chips 4 are applied through clips 3. Carriers 1 are provided with a metallization (wiring) which is surrounded by a ring 5 holding cap 6 to hermetically seal the chips. The proposed module allows all known chip attachment techniques, such as wire bonding or C4 flip-chip solder connections.