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Thermal Expansion-Matched Thin Film Metallized Substrate

IP.com Disclosure Number: IPCOM000062969D
Original Publication Date: 1985-Jan-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Tummala, RR [+details]

Abstract

This modification relates to the use of glass-ceramic for MC (metallized ceramic) type of substrate application. In this application, glass-ceramics are formed by dry-press or tape process to form blank ceramic substrates on which thin films of metals and dielectrics are deposited in an MC-like fashion. Such a package, assuming the heat dissipation to be taken away from the back of the chip, can provide major improvements in the following areas: 1. Electrical signal propagation due to low dielectric constants. 2. Increased density of wiring because of 2-3X improvement in surface smoothness. 3. Significant improvement in fatigue life of silicon chips as C-4 bonded to substrates because of the perfect thermal match with silicon. 4.