Chip Identification Reader
Original Publication Date: 1985-Jan-01
Included in the Prior Art Database: 2005-Feb-18
As chips are diced from wafers during semiconductor processing and subjected to the various process steps for joining to the module, manufacturing data, e.g., part number, master slice and personality job numbers, master slice identification (ID), and silicon crystal ID, etc., is lost. Manufacturing may rely upon operator discipline (no chip mix-up, correct chip orientation in the carrier, job makeup, etc.) to insure that the correct chips are assembled to the correct module location. However, for certain array chips, the chip part number cannot be identified until final electrical test. When such chips are accidentally mixed up, because of a lack of direct traceability they must be scrapped.