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Surface-Mounted Component Alignment Fixture

IP.com Disclosure Number: IPCOM000063030D
Original Publication Date: 1985-Feb-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Gillen, EJ Watson, DP [+details]

Abstract

The figure illustrates a fixture 10 which is employed in a component placement machine for aligning a surface mounted component relative to a semiconductor substrate. The method of assembling a surface-mounted component onto a substrate involves the steps of, first, applying solder paste by screening onto the substrate at the location where solder joints are to occur between the pads on the substrate and the leads of the component. Next, the components are transported from a pick-up station to the substrate and placed into the paste pattern. The component, paste and substrate are then heated until the solder reflows and bonds the leads to the pad. The assembly is then cooled.