Browse Prior Art Database

Peltier Couple

IP.com Disclosure Number: IPCOM000063045D
Original Publication Date: 1985-Feb-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Davis, JW Swindal, WN [+details]

Abstract

This article describes a technique that utilizes a solid-state heat pump (Peltier Couple) to actively remove heat from the junction area of a chip through the use of polysilicon synthetic metal. Evolution in silicon to denser and faster circuits is being limited at the application by thermal constraints. Present day techniques focus on reducing thermal resistance from the chip junction to the ultimate cooling environment, a passive approach. Described herein is an active technique to remove heat from the junction area of a chip. The functionality of a Peltier Couple has been established in various publications. The uniqueness of the present concept is its application to very large-scale integration circuit chips through the use of polysilicon synthetic metal. The structure of the Peltier Couple 1 is shown in Figs. 1A and 1B.