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Positive Resist Stripping Improvement

IP.com Disclosure Number: IPCOM000063094D
Original Publication Date: 1985-Feb-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Bazot, M Haren, D Pelle, C [+details]

Abstract

In the semiconductor manufacturing process the solubility of positive photoresist is often limited by the use of special treatments, such as baking, hardening, reflow. If one wants to use a gentle stripper, the solubility may be insufficient. To improve the solubility of the resist in the stripper, it is possible to use a UV blanket exposure after resist development and before special treatment to crack the polymer. This technique does not change the resist quality required for etch (dry or wet) and permits the use of a less aggressive stripper.