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Methods for Increasing the Number of Connections Between Packaging Levels

IP.com Disclosure Number: IPCOM000063107D
Original Publication Date: 1985-Feb-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Linsker, R [+details]

Abstract

The number of connections per unit area between levels of circuits or between circuit levels and semiconductor chips where thermal mismatch limits the distance between connections can be increased by placing the connectors at the vertices of an equilateral triangle lattice. This triangular positioning arrangement provides a density of connectors that is 15% greater than the density based on a square positioning arrangement and is usable with interdigitated radial power and signal groupings. The positioning may be conveniently implemented within an overall circular or square configuration.