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Deformed Pin Arrangement for Surface-Mountable Modules Disclosure Number: IPCOM000063122D
Original Publication Date: 1985-Feb-01
Included in the Prior Art Database: 2005-Feb-18

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Related People

Bakos, P Funari, J Napp, DT Rivenburgh, DL [+details]


An improved method to attach a semiconductor module or similar component to a circuit board or card is described in which the module I/O pins are bent at right angles to permit the portion of the pin extending parallel to the bottom surface of the module to be surface soldered to the parallel pad on the printed circuit board. Fig. 1 shows a typical integrated circuit module 10 having a plurality of I/O pins 11 which extend through the back seal 12 into the substrate 13. A semiconductor chip 14 is suitably attached to substrate 13, and the assembly is covered by a cap 15. Fig. 2 is a view illustrating how the module 10 is attached to a printed circuit board 20. As seen in Fig. 2, section H of I/O pin 11 is disposed parallel to pad 22 of pc board 20 and electrically and mechanically attached thereto by solder fillet 24.