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Semiconductor Wafer Pick-Up Tool Disclosure Number: IPCOM000063255D
Original Publication Date: 1985-Mar-01
Included in the Prior Art Database: 2005-Feb-18

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Pinckney, WJ [+details]


This article concerns the application of robotics to automatic wafer handling. A robotic wafer pick-up tool is described herein which minimizes exposure of wafers to contamination, e.g., scratches and/or particulate contamination, occurring during automated transport of wafers from process plate to wafer carrier. This is accomplished through the elimination of any tool contact with the sides or top surface of the wafer during load/unload operations. The disclosed wafer pick-up tool, as shown in Fig. 1, includes four major elements: a double vacuum forked tongue 1 which is on a slide, a flexure-mounted pick-up finger 2 which is cam operated, an air cylinder 3 which controls movement of 1, and the tool mount attachment 4 to the robot. Figs.