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One-Piece Thermal Heat Sink/Module Cap

IP.com Disclosure Number: IPCOM000063273D
Original Publication Date: 1985-Mar-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Kotrch, GS [+details]

Abstract

Heat sinks are attached to thermal module caps to enhance heat dissipation. The adhesive between the cap and heat sink, however, degrades the efficiency of the heat transfer system. A design combining the heat sink and cap as one piece is provided as well as a method of producing the part. The thermal cap design includes all the necessary requirements of both the thermal cap and a suitable heat sink configuration. The method of manufacture for these caps 11 is to use the "impact extrusion" process. A die 12 containing the outer shape of the one-piece cap 11 is mounted on the bed 13 of an extrusion press. A punch 14 is mounted into the upper ram 15 of the press.