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Three-Dimensional Module Power and Signal Distribution Mechanism Disclosure Number: IPCOM000063278D
Original Publication Date: 1985-Mar-01
Included in the Prior Art Database: 2005-Feb-18

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Related People

Johnson, RE [+details]


This article describes a scheme for increasing the available signal I/O capability of pluggable MLC (multilayer ceramic) circuit modules by bringing the power distribution network to the module through a unique top-cap connection structure. Selective metallization of the outer sides of the ceramic cap structure is employed in conjunction with a system of spring contacts to provide a three-dimensional power connection and distribution system to the module. While the example illustrated in this article applies specifically to a pluggable MLC multi-chip module (MCM), the disclosed interconnection structure (which offers significant cost savings and is readily implementable) applies equally to metallized ceramic (MC) and glass-ceramic pluggable/solderable module structures. Fig.