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Three-Dimensional Discrete Wire Fan-Out Pattern

IP.com Disclosure Number: IPCOM000063282D
Original Publication Date: 1985-Mar-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Canestaro, MJ [+details]

Abstract

A discrete wire fan-out pattern (3-D), designed to connect the chip to the substrate, requires one end of the die to be restrung with wires upon removal of the 3-D fan-out pattern, once the wires are cast in place. To overcome the restringing problem, two substrate dies 11, 12 are strung with wire 13, and die 12 furthest from the spools 14 is then rotated a predetermined amount so that the wires line up to form a C-4 pattern. The twisted wires are then potted 15.