Browse Prior Art Database

Chip-Picking Needle Cluster

IP.com Disclosure Number: IPCOM000063294D
Original Publication Date: 1985-Mar-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Engelbride, EF Mowell, J Uberbacher, G Walsh, TJ [+details]

Abstract

Disclosed is the fabrication of needle cluster arrays utilized in the chip-handling operations of semiconductor manufacturing. A low cost 'throw away' item that eliminates operator-judgment call in tool head wear replacement is produced. The molded needle cluster is intended as a replacement for an expensive machined metal cluster. The needles 3 are molded in the same process step as the shank 1 and the protective sleeve 4. The protective sleeve is joined to the needle housing with a breakaway collar 5. When the needle cluster assembly is placed in the tool, a setscrew is tightened against the shank 1 to hold the cluster in place. At that time the protective collar 4 is removed by twisting the collar sufficiently to break the joint 5.