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Practical Angled Magnetron Target

IP.com Disclosure Number: IPCOM000063362D
Original Publication Date: 1985-Mar-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Blackwell, KJ White, RF White, RT Wilson, JW [+details]

Abstract

The present system for vacuum depositing a material onto a sample, having a hole or channel, has a vacuum chamber capable of attaining a high vacuum, a planar magnetron cathode/target assembly for emitting sputtered atoms, a power supply connected to the magnetron to initiate emission of these atoms, and the sample which receives these atoms. The sample contains one or more holes or channels in which it is desired to deposit as much material as possible. This article describes a modification to the planar magnetron target (Fig. 1) such that the deposition of material onto the walls of the holes or channels is more efficient by increasing the ratio of hole and channel wall to surface deposition (Fig. 2).