Wet Etching for Line Deletion and Short Repair on Ceramic Substrates
Original Publication Date: 1985-Mar-01
Included in the Prior Art Database: 2005-Feb-18
The disclosed procedure is to apply a layer of photoresist to the substrate and then selectively remove the resist to allow wet chemical etching of unwanted metallurgy. Referring to the figures, perform the following: 1. Cover the substrate with photoresist. 2. Selectively remove the resist to expose unwanted metallurgy. 3. Remove the unwanted metal by wet chemical etching. 4. Remove the remaining resist. Two processes can be used to selectively remove the resist. The first way is to expose the resist using any lithographic technique, and develop it to clear the areas to be etched. The second method is the ablative photodecomposition process which utilizes an excimer laser to open an area in the resist.