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Wafer Ejection Mechanism Disclosure Number: IPCOM000063378D
Original Publication Date: 1985-Mar-01
Included in the Prior Art Database: 2005-Feb-18

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Related People

Egan, JP Vonburg, H [+details]


This is a mechanism that repositions a semiconductor wafer in a process tool in a precise way, reliably and without damage to the wafer. The mechanism utilizes positioning fingers 1 located at each wafer nest location 2 that do not interfere with the normal rotational actions of the tool. The fingers are free to move in a sleeve and are reset automatically by the centrifugal forces developed during the spin cycle of the process tool. After the spin cycle, the wafers, located in the nest, are moved incrementally to an unload station 3. Prior to this location a spring-loaded kickout roller 4 comes in contact with the ejection fingers 1. The physical length of the ejection fingers 1 determines the precise distance the wafer will be moved in the nest 2.