Coated Wafer Carriers
Original Publication Date: 1985-Mar-01
Included in the Prior Art Database: 2005-Feb-18
A number of wafer carrier problem areas exist. These involve contamination, a need for a great number of carrier types, and a loss of dimensional stability during multi-phase processing and over a period of time. In addition, considerable handling contributes to wafer damage and contamination of the wafer. It also makes implementation of any automated logistic approach extremely difficult. A fluoropolymer-coated (such as tetrafluoroethylene resin-coated) metal wafer carrier will provide a dimensionally stable carrier with a sealed, low friction surface coating which may be used for oven and acid processes up to 260ŒC. If the coating is used on high temperature polymers, it will extend the usage temperature for molded carriers from 160 to 200 degrees.