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Developer Solution for Solvent Dry Resist Materials

IP.com Disclosure Number: IPCOM000063395D
Original Publication Date: 1985-Mar-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Arnold, E [+details]

Abstract

For producing circuit boards, 1.1.1-trichloroethane, containing two stabilizers that favorably influence the development step, is used for the development of solvent-dry resist materials. Commercially available formulations of 1.1.1-trichloroethane generally contain three and more stabilizers, one of which serves to prevent the occurrence of Friedel-Crafts reactions when light-metals are degreased. This stabilizer is superfluous for the above-described application. Tests have shown that the following 2-stabilizer system is most favorable for the exposure of dry resist materials: 1.1.1-trichloroethane 97.8 - 97.2 percent by weight 1.2-butylene chloride 0.4 - 0.6 percent by weight tert-butanol 1.8 - 2.