Surface Preparation by Plasma Exposure
Original Publication Date: 1985-Mar-01
Included in the Prior Art Database: 2005-Feb-18
Exposing the surface of a photoresist-laminated board to plasma reduces plating voids after electroplating copper onto a plastic-treated surface, in the additive bath of the board area. A board treated in this manner demonstrates a significant reduction in electroplated defects after having been in the additive bath as compared to a board which has not been exposed to plasma treatment.