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Surface Preparation by Plasma Exposure

IP.com Disclosure Number: IPCOM000063396D
Original Publication Date: 1985-Mar-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Agostino, PA Welsh, J [+details]

Abstract

Exposing the surface of a photoresist-laminated board to plasma reduces plating voids after electroplating copper onto a plastic-treated surface, in the additive bath of the board area. A board treated in this manner demonstrates a significant reduction in electroplated defects after having been in the additive bath as compared to a board which has not been exposed to plasma treatment.