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Method for Molding Cables Into Product Enclosures

IP.com Disclosure Number: IPCOM000063414D
Original Publication Date: 1985-Mar-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
McSpadden, SK Williamson, JA [+details]

Abstract

A method is described to mold product enclosures with integral cables, circuitry and connectors. First, the cables, etc., are prepared and inserted into the mold cavity. Next, the enclosure material is injected into the mold, encapsulating the cables, etc., in the enclosure. A number of polymer molding processes may be employed. Reaction Injection Molding (RIM) is particularly appropriate. RIM processes utilize liquid polymer systems which react and cure when mixed. RIM materials enter the mold cavity at significant lower viscosities than conventional thermoplastic materials. This lower processing viscosity facilitates the ability to encapsulate "flexible" inserts.