Chip Identification Writing System
Original Publication Date: 1985-Mar-01
Included in the Prior Art Database: 2005-Feb-18
A Chip Identification Writing System disclosed in this article imprints machine-readable coded manufacturing data on the inactive side (backside) of a semiconductor chip following initial electrical test and prior to its separation from a wafer by dicing, thereby ensuring the positive identification of each chip with its manufacturing source data. When chips are diced from wafers in preparation for next level processing, they ordinarily suffer a permanent loss of manufacturing traceability, e.g., part number, master slice and personality job numbers, master slice identification (ID), etc. In specific instances, even chip part numbers cannot be further identified until final electrical test.