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Module Reclamation

IP.com Disclosure Number: IPCOM000063461D
Original Publication Date: 1985-Mar-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Caulfield, JJ Moore, RJ [+details]

Abstract

The problem is removing old solder from reclaimed module pins using heat. Old solder climbs the pins to the pin braze joint when heat is applied. Old solder penetrates the pin braze joint causing joint deterioration. Module Description (in part): o Ceramic substrate o Pin material - KOVAR* (nickel/gold plated) o Solder - 60/40 or equivalent It is proposed to remove old solder without heat. Initial heat may be required at the pin tips to remove solder balls, etc. This heat application would not be detrimental. The method is to use a non-abrasive media in a blast gun to remove the unwanted solder. An optimum blast media, which is non-abrasive, harder than solder, but softer than nickel, is employed. The pin joint and ceramic surface are protected by a removable mask or by a wash-off potting compound.