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Circular Array Pad on Pad Connector System

IP.com Disclosure Number: IPCOM000063464D
Original Publication Date: 1985-Mar-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
Petrozello, JR [+details]

Abstract

A circular pad on pad connector mechanism is used as an alternative to I/O pin and connector designs. The circular array connector (Fig. 1) is a glass-filled polymeric structure with individual contact beam members 2 arranged radially around the device body to allow even load distribution of the device during use. The connector body and contact beams are selectively plated to form signal lines 3 and contact surfaces 4. The device 1 is attached to a signal distribution circuit card 5 (Figs. 2, 3) by means of solder pads 6 on top of the connector body and solder pads 7 at the circuit card interface. A signal cable 8 is attached to the circuit card 5 by soldering the signal wires 25 to card surface pads. A molded strain relief 9 encapsulates and strain relieves the circuit card to signal cable interface.