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Molding of EMI and RFI Shielding Into Product Enclosures

IP.com Disclosure Number: IPCOM000063469D
Original Publication Date: 1985-Mar-01
Included in the Prior Art Database: 2005-Feb-18

Publishing Venue

IBM

Related People

Authors:
McSpadden, SK Williamson, JA [+details]

Abstract

A method is described for molding product enclosures with integral Electro-Magnetic Interference (EMI) and Radio Frequency Interference (RFI) shielding using Reaction Injection Molding (RIM) technology and a preformed conductive insert. First, the conductive shield insert is preformed to the proper enclosure shape (i.e., using metal foil, etc.). Next, the preform is inserted into the mold, and the enclosure material is injected into the mold, encapsulating the conductive insert into the enclosure. If desired, the mold may be treated so that the RIM material will produce a decorative external finish which can then be painted in a later operation. RIM processes utilize liquid polymer systems which react and cure when mixed.